Additional TPSCo pages:

TPSCo Overview and History

Tower Partners Semiconductor Co., Ltd. (TPSCo)

TPSCo has three manufacturing facilities in Hokuriku, Japan which have been producing large scale integrated circuits for over 35 years. More than 750 million ICs for automotive products (Grade 0, 1 & 2) have been produced by TPSCo fabs since inception.
Areas of process technology focus include: Radio Frequency (RF), High Performance Analog (HPA), integrated Power Management, CMOS Image Sensors (CIS), and Mixed-Signal CMOS.
With over 150 qualified silicon process flows on 200mm and 300mm wafers from super micron to 45nm as well as internal back end processing, assembly and test services, TPSCo provides both IDMs and fabless companies with unparalleled semiconductor manufacturing quality and technology.

Technology Platforms

History

1976

Semiconductor assembly production started in Arai fab, Niigata, Japan.

1984

Semiconductor wafer production started in Uozu fab, Toyama, Japan.

1994

Semiconductor wafer production started in Tonami fab, Toyama, Japan.

2014

TowerJazz Panasonic Semiconductor Co., Ltd. (TPSCo) was established as a joint venture of the Tower Semiconductor and Panasonic.

2020

Company name was changed to Tower Partners Semiconductor Co., Ltd.

Quick Facts

Company name: Tower Partners Semiconductor Co., Ltd.

Establishment: February 28, 2014 (Operating April 1st, 2014)

Representative: Chief Executive Officer Keiji Jono

Business Offices

  • Uozu site (Headquarters) — Uozu-city Toyama, Japan
  • Kyoto office — Nagaokakyo-city Kyoto, Japan
  • Arai site — Myoko-city Niigata, Japan
  • Tonami site — Tonami-city Toyama, Japan