Tower Semiconductor to Present at 2021 SEMICON China Addressing Advanced High Voltage and SOI Technologies for Smart Power Applications

Presenting Company’s leading edge power management platform as part of the Power & Compound Semiconductor International Forum 2021

MIGDAL HAEMEK, Israel, March 15, 2021 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry of high value analog semiconductor solutions, today announced its participation at the upcoming 2021 SEMICON China conference addressing advanced high voltage and SOI technologies for smart power applications as part of the Power & Compound Semiconductor International Forum 2021.

The conference will be held in Pudong Kerry Hotel, Shanghai, China on March 18-19, 2021. During the conference, Mrs. Yuna Cai, Technical Support Manager at Tower Semiconductor, will present “Advanced High Voltage Bulk & SOI Technologies for Smart Power Applications”, describing Tower’s best in class power management platform and its newly developed innovative solutions designed to address the evolving 5G market needs and specifications in China and worldwide.

Presentation is scheduled for March 19th, 2021, at 13:30-13:55.

For additional details on Tower’s power management platform, please visit here.
For additional details on Tower Semiconductor’s technology offering, please visit here.
For additional details on SEMICON CHINA 20201, please visit here.

About Tower Semiconductor

Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM), the leading foundry of high value analog semiconductor solutions, provides technology and manufacturing platforms for integrated circuits (ICs) in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating positive and sustainable impact on the world through long term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as Transfer Optimization and development Process Services (TOPS) to IDMs and fabless companies. To provide multi-fab sourcing and extended capacity for its customers, Tower Semiconductor operates two manufacturing facilities in Israel (150mm and 200mm), two in the U.S. (200mm) and three facilities in Japan (two 200mm and one 300mm) through TPSCo. For more information, please visit:

Safe Harbor Regarding Forward-Looking Statements

TThis press release includes forward-looking statements, which are subject to risks and uncertainties. Actual results may vary from those projected or implied by such forward-looking statements. A complete discussion of risks and uncertainties that may affect the accuracy of forward-looking statements included in this press release or which may otherwise affect Tower’s business is included under the heading “Risk Factors” in Tower’s most recent filings on Forms 20-F, F-3, F-4 and 6-K, as were filed with the Securities and Exchange Commission (the “SEC”) and the Israel Securities Authority. Tower does not intend to update, and expressly disclaim any obligation to update, the information contained in this release. 


Tower Semiconductor Company Contact:

Orit Shahar | +972-74-7377440 |

Tower Semiconductor Investor Relations Contact:

Noit Levi | +972-4-604-7066 |